Four grades from BASF will now be available for MID production

A range of materials from BASF could soon be used in revolutionary electronic circuits. The company has signed an agreement with laser specialist LPKF. This will allow BASF to used LPKF’s laser-sensitive metal organic complex as an additive in its polyamide, POM, PES and PSU materials.

Components made from these grades can have electronic tracks etched directly onto their surface using a laser. This technique, called laser direct structuring (LDS) promises to simplify the production of moulded interconnect devices. The polyamide used is a 30% glass-filled grade of Ultramid T, a nylon 66 material.

LPKF already has similar agreements with Ticona, Bayer and Degussa, for LCPs, PET and PBT. The technique has already been used commercially by Luxembourg-based A&I Industries to make antennae for mobile phones.