Fujitsu and Toray have developed a PLA-PC alloy with high impact resistance

Electronics group Fujitsu has succeeded in developing a prototype mobile phone chassis using a more impact-resistant form of its biopolymer. Working with fellow Japanese company Toray Industries, Fujitsu has refined the microstructure and improved the mixing compatibility of its polylactic acid (PLA) material with polymer alloyed polycarbonate, which has a high glass transition temperature.

Fujitsu says the new polymer alloy has the same heat resistance and moulding properties of the PLA previously developed by the companies, but with a 50% improvement in impact resistance. Fujitsu has exhibited the mobile phone chassis at the Tokyo International Forum this week. It says it plans to use the new plastic in future mobile phone models to reduce the use of petroleum-based plastics.

The company introduced the world's first notebook PC with chassis parts made from corn-based PLA in 2002. Then, with Toray, it produced last year a full-size notebook chassis in PLA with high heat-resistance, low flammability and good mouldability