The new grade is aimed at thin-wall components

Bayer MaterialScience has released a PC/ABS grade for expansion injection moulding, which, it claimed, enables cost-effective production of thin-walled components.

The company has developed a customised Bayblend grade that allows components, with wall thicknesses of less than 0.18mm, to be manufactured using Engel’s X-Melt expansion injection moulding process. The grade has been used to make a cellphone battery cover – with a wall thickness less than 0.18mm.

“Up until now, this type of PC/ABS cover couldn’t be made so thin,” said Bayer MaterialScience polycarbonate expert Hans-Joerg Dahmen. Dahmen said potential applications included cellphone components – battery covers and casings and cellphone casings – and the production of micro-precision components.